China’s SiCarrier Shocks Chip Industry with Broad Lineup of Chip Equipment at SEMICON 2025, Threatening ASML’s Market Lead

China’s chip industry is making waves again as SiCarrier, the country’s leading chip equipment manufacturer, launches an extensive range of new tools designed to boost domestic semiconductor production.

In recent years, the semiconductor sector in China has experienced significant growth, driven by the country’s determination to lessen external dependency. Key players like Huawei and SMIC have contributed notably to setting up local chip production facilities, achieving commendable success. SiCarrier, a lesser-known yet vital part of this ecosystem, supposedly backed by Huawei, focuses on manufacturing chipmaking equipment. At China’s SEMICON 2025 event, they showcased their latest offerings, signaling their resolve to advance without restrictions.

A social media post from @zephyr_z9 shed light on SiCarrier’s recently unveiled tool lineup at SEMICON. Their portfolio includes various chipmaking instruments like Rapid Thermal Processing (RTP) systems, pivotal in semiconductor manufacturing for integrated circuits. Interestingly, their catalog does not include lithography tools, suggesting that SiCarrier might be keeping these developments under wraps for now. This strategic move positions them against major companies like ASML and LAM, although the effectiveness of these tools within China remains to be seen.

During SEMICON, SiCarrier’s President, Du Lijun, announced that their domestic equipment could produce 5nm chips. However, using non-optical technology poses yield rate challenges, resulting in more expensive outputs compared to international alternatives. In collaboration with SMIC and Huawei, SiCarrier is exploring solutions to this issue, aiming to enhance China’s chip production capabilities significantly.

Du Lijun hinted at leveraging non-optical technologies in addressing lithography challenges, a statement that underscores the innovation underway within the company.

The overarching goal for SiCarrier is to shift the semiconductor landscape’s power balance away from countries like the Netherlands, a major provider of chipmaking technology. An earlier report highlighted SiCarrier’s joint efforts with Huawei and the Shenzhen government to develop unique EUV prototypes utilizing laser-induced discharge plasma (LDP). This development marks a crucial step towards China’s ambition to establish its own EUV lithography equipment and overcome the main obstacle hindering its progress in creating advanced chip nodes.